SEP202027

AICAS 2027: 9th IEEE International Conference on Artificial Intelligence Circuits and Systems

by IEEE

conferenceIn-PersonUpcomingStarts in 11 months

Research on the chips, circuits and memory systems that run AI, in Hangzhou

September 20–22, 2027·Hangzhou, China·Paid
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THE DAILY BRIEF
SEP202027
AICAS 2027: 9th IEEE International Conference on Artificial Intelligence Circuits and Systems

by IEEE

conferenceIn-Personupcoming

Research on the chips, circuits and memory systems that run AI, in Hangzhou

About This Event

AICAS 2027, the 9th IEEE International Conference on Artificial Intelligence Circuits and Systems, runs September 20-22, 2027 in Hangzhou, China, co-located with APCCAS 2027 for the first time. It is a research conference on the hardware underneath AI: accelerators for agentic AI, LLMs and multimodal foundation models, computing-in-memory, neuromorphic circuits, chiplets and 3D integration, and low-power inference at the edge. Papers run up to five pages under double-blind review, and accepted and presented papers are submitted to IEEE Xplore. The program also has special sessions and tutorials of 1.5 hours or a half day.

At a Glance

Date
September 20–22, 2027
Location
Hangzhou, China
Format
In-Person
Event Type
Conference
Status
Upcoming
Pricing
Paid
Organizer
IEEE
Added
Nov 5, 2026
Updated
Nov 5, 2026

Topics & Focus Areas

Accelerators for agentic AI and LLMsComputing-in-memoryNeuromorphic and spiking circuitsEdge and on-device AIChiplets and 3D integrationAI for EDAHardware for embodied AITrustworthy AI hardware

Who Should Attend

  • ✓AI chip architects
  • ✓Circuit and hardware researchers
  • ✓EDA engineers
  • ✓Edge AI engineers
  • ✓Heads of AI infrastructure
  • ✓Semiconductor strategy leads

Organizer

I

IEEE

2027.ieee-aicas.org/

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About This Event

AICAS 2027, the 9th IEEE International Conference on Artificial Intelligence Circuits and Systems, runs September 20-22, 2027 in Hangzhou, China, co-located with APCCAS 2027 for the first time. It is a research conference on the hardware underneath AI: accelerators for agentic AI, LLMs and multimodal foundation models, computing-in-memory, neuromorphic circuits, chiplets and 3D integration, and low-power inference at the edge. Papers run up to five pages under double-blind review, and accepted and presented papers are submitted to IEEE Xplore. The program also has special sessions and tutorials of 1.5 hours or a half day.

Key Dates & Deadlines

  • Workshop proposal deadline (special sessions and tutorials)
  • Paper submission deadline
  • Tutorial proposal notification
  • Notification to authors
  • Camera-ready deadline (final paper and author registration)

At a Glance

Date
September 20–22, 2027
Location
Hangzhou, China
Format
In-Person
Event Type
Conference
Status
Upcoming
Pricing
Paid
Organizer
IEEE
Added
Nov 5, 2026
Updated
Nov 5, 2026

Topics & Focus Areas

Accelerators for agentic AI and LLMsComputing-in-memoryNeuromorphic and spiking circuitsEdge and on-device AIChiplets and 3D integrationAI for EDAHardware for embodied AITrustworthy AI hardware

Who Should Attend

  • ✓AI chip architects
  • ✓Circuit and hardware researchers
  • ✓EDA engineers
  • ✓Edge AI engineers
  • ✓Heads of AI infrastructure
  • ✓Semiconductor strategy leads

Why Attend

AICAS suits a CTO, chief architect or head of AI infrastructure who has to judge where inference hardware goes after the current GPU cycle. The call covers accelerators for LLMs and agents, computing-in-memory, chiplets, and low-power on-device inference, all of which affect multi-year hardware and edge decisions. This is early-stage research, and most of it is years from a purchase order, so send a hardware architect who can sort the results and report back on what is worth tracking.

Event Features

  • ✓CFP area: accelerators for agentic AI, LLMs, and multimodal foundation models
  • ✓CFP area: hardware for embodied AI, including perception, sensor fusion, motion control and robotics processors
  • ✓CFP area: computing-in-memory, near-memory and processing-in-sensor architectures
  • ✓CFP area: hardware-software co-design, compilers, and AI for EDA
  • ✓CFP area: chiplets, 3D integration, and memory systems for AI
  • ✓Special sessions (typically 5 papers) and tutorials of 1.5 hours or a half day
  • ✓Co-located APCCAS 2027

What Makes This Unique

  • ★Its scope is AI hardware only, from emerging devices to compilers and hardware-software co-design
  • ★The 2027 call names accelerators for agentic AI and hardware for embodied AI as its first topics
  • ★Co-located with APCCAS 2027 for the first time
  • ★Industry liaison chairs come from Synopsys, NXP Semiconductors and Alibaba Hangzhou

Industries Represented

SemiconductorsRoboticsHealthcareManufacturingAutomotive

Pricing Details

The conference home page and call for papers list no registration fees as of November 5, 2026. Final papers and author registration are due July 23, 2027.

Organizer

Frequently Asked

When is AICAS 2027?
AICAS 2027 takes place September 20–22, 2027 in Hangzhou, China.
Where is AICAS 2027 held?
AICAS 2027 is held in Hangzhou, China. The event format is in-person.
What is the AICAS 2027 submission deadline?
The next AICAS 2027 deadline is workshop proposal deadline (special sessions and tutorials) on Mar 10, 2027. Remaining dates: Paper submission deadline — Apr 13, 2027; Tutorial proposal notification — May 31, 2027; Notification to authors — Jun 13, 2027; Camera-ready deadline (final paper and author registration) — Jul 23, 2027.
How much does AICAS 2027 cost?
AICAS 2027 is paid. The conference home page and call for papers list no registration fees as of November 5, 2026. Final papers and author registration are due July 23, 2027.
Who should attend AICAS 2027?
AICAS 2027 is aimed at AI chip architects, Circuit and hardware researchers, EDA engineers, Edge AI engineers, Heads of AI infrastructure, Semiconductor strategy leads.
What topics does AICAS 2027 cover?
AICAS 2027 covers Accelerators for agentic AI and LLMs, Computing-in-memory, Neuromorphic and spiking circuits, Edge and on-device AI, Chiplets and 3D integration, AI for EDA, Hardware for embodied AI, Trustworthy AI hardware.

Sources

This page was written from 3 sources, 2 on domains other than 2027.ieee-aicas.org.

  1. 1.2027.ieee-aicas.org — 2027.ieee-aicas.orgvendor
  2. 2.easychair.org — AICAS2027
  3. 3.ieee-cas.org — 5282
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