JUN202027

2027 Symposium on VLSI Technology and Circuits

by Symposium on VLSI Technology and Circuits (with IEEE Electron Devices Society and IEEE Solid-State Circuits Society)

conferenceIn-PersonUpcomingStarts in 9 months

From Atoms to Intelligence: VLSI Empowering Society

June 20–24, 2027·Rihga Royal Hotel Kyoto, Japan·Paid
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THE DAILY BRIEF
JUN202027
2027 Symposium on VLSI Technology and Circuits

by Symposium on VLSI Technology and Circuits (with IEEE Electron Devices Society and IEEE Solid-State Circuits Society)

conferenceIn-Personupcoming

From Atoms to Intelligence: VLSI Empowering Society

About This Event

The 2027 Symposium on VLSI Technology and Circuits is a semiconductor research conference at the Rihga Royal Hotel Kyoto in Kyoto, Japan, running Sunday 20 June to Thursday 24 June 2027. Workshops are on 20 June, full-day short courses on 21 June and technical sessions from 22 to 24 June. It is planned as a fully in-person event, with papers available on demand afterward. The 2026 edition was in Honolulu and the 2025 edition in Kyoto. The 2027 theme covers the chain from atomic-scale materials through circuits, architecture and packaging to the AI systems they enable, and the call names devices and accelerators for ML/DL as its own submission area. Program co-chairs come from NVIDIA and Intel, and the symposium co-chairs from Applied Materials and AMD.

At a Glance

Date
June 20–24, 2027
Location
Rihga Royal Hotel Kyoto, Japan
Format
In-Person
Event Type
Conference
Status
Upcoming
Pricing
Paid
Organizer
Symposium on VLSI Technology and Circuits (with IEEE Electron Devices Society and IEEE Solid-State Circuits Society)
Added
Oct 10, 2026
Updated
Oct 10, 2026

Topics & Focus Areas

Devices and accelerators for ML/DLAdvanced CMOS and backside power deliveryChiplets and 2.5D/3D heterogeneous integrationMemory technologies and architecturesOptical interconnects and wireline transceiversProcessors and SoCsBeyond-CMOS and quantum computing devicesHardware security

Who Should Attend

  • ✓Semiconductor process and device engineers
  • ✓Chip architects and SoC designers
  • ✓AI accelerator hardware teams
  • ✓CTOs and R&D heads at semiconductor and systems companies
  • ✓Memory and packaging technologists
  • ✓Academic researchers in microelectronics

Organizer

S

Symposium on VLSI Technology and Circuits (with IEEE Electron Devices Society and IEEE Solid-State Circuits Society)

vlsisymposium.org/

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About This Event

The 2027 Symposium on VLSI Technology and Circuits is a semiconductor research conference at the Rihga Royal Hotel Kyoto in Kyoto, Japan, running Sunday 20 June to Thursday 24 June 2027. Workshops are on 20 June, full-day short courses on 21 June and technical sessions from 22 to 24 June. It is planned as a fully in-person event, with papers available on demand afterward. The 2026 edition was in Honolulu and the 2025 edition in Kyoto. The 2027 theme covers the chain from atomic-scale materials through circuits, architecture and packaging to the AI systems they enable, and the call names devices and accelerators for ML/DL as its own submission area. Program co-chairs come from NVIDIA and Intel, and the symposium co-chairs from Applied Materials and AMD.

Key Dates & Deadlines

  • Paper submission deadline (23:59 JST)

At a Glance

Date
June 20–24, 2027
Location
Rihga Royal Hotel Kyoto, Japan
Format
In-Person
Event Type
Conference
Status
Upcoming
Pricing
Paid
Organizer
Symposium on VLSI Technology and Circuits (with IEEE Electron Devices Society and IEEE Solid-State Circuits Society)
Added
Oct 10, 2026
Updated
Oct 10, 2026

Topics & Focus Areas

Devices and accelerators for ML/DLAdvanced CMOS and backside power deliveryChiplets and 2.5D/3D heterogeneous integrationMemory technologies and architecturesOptical interconnects and wireline transceiversProcessors and SoCsBeyond-CMOS and quantum computing devicesHardware security

Who Should Attend

  • ✓Semiconductor process and device engineers
  • ✓Chip architects and SoC designers
  • ✓AI accelerator hardware teams
  • ✓CTOs and R&D heads at semiconductor and systems companies
  • ✓Memory and packaging technologists
  • ✓Academic researchers in microelectronics

Why Attend

If your AI roadmap depends on how fast accelerator, memory and packaging technology improves, this is where the evidence is published, often a year before it reaches a product. A CTO or hardware strategy lead hears process and circuit results from foundries, memory makers and chip designers in one program, can question the authors directly, and comes away with a grounded view of what backside power, chiplets and new memory will deliver for inference cost and power.

Event Features

  • ✓Call-for-papers area: Devices and Accelerators for ML/DL and New Computing, including optical and quantum computing
  • ✓Call-for-papers area: Advanced packaging, chiplet and heterogeneous integration including 2.5D and 3D
  • ✓Call-for-papers area: Memory technologies, devices, circuits and architectures
  • ✓Call-for-papers area: Wireline and optical transceivers, optical interconnects and processors
  • ✓Full-day short courses on 21 June 2027
  • ✓Workshops on 20 June 2027 (call for workshop proposals to be announced)
  • ✓Focus sessions, demo session and Best Student Paper Award

What Makes This Unique

  • ★Joint technology and circuits program, so process engineers and circuit designers review the same results in one week
  • ★Accepted papers are published as submitted with no revisions, and outstanding ones are invited to IEEE Transactions on Electron Devices and the IEEE Journal of Solid-State Circuits
  • ★Industry-led organizing committee for 2027, with co-chairs from NVIDIA, Intel, AMD and Applied Materials
  • ★The 2025 Kyoto edition ran plenaries on DRAM for the AI era and edge AI, plus a workshop on circuits for LLM inference

Featured Speakers From

NVIDIAIntelAMDApplied MaterialsRenesas ElectronicsTohoku UniversityThe University of Tokyo

Industries Represented

SemiconductorsComputing hardwareElectronics

Pricing Details

2027 registration fees are not yet published; the first call for papers lists dates and venue only.

Organizer

S

Symposium on VLSI Technology and Circuits (with IEEE Electron Devices Society and IEEE Solid-State Circuits Society)

vlsisymposium.org/

Frequently Asked

When is 2027 Symposium on VLSI Technology and Circuits?
2027 Symposium on VLSI Technology and Circuits takes place June 20–24, 2027 in Kyoto, Japan.
Where is 2027 Symposium on VLSI Technology and Circuits held?
2027 Symposium on VLSI Technology and Circuits is held in Kyoto, Japan. The event format is in-person.
What is the 2027 Symposium on VLSI Technology and Circuits submission deadline?
The next 2027 Symposium on VLSI Technology and Circuits deadline is paper submission deadline (23:59 jst) on Jan 25, 2027.
How much does 2027 Symposium on VLSI Technology and Circuits cost?
2027 Symposium on VLSI Technology and Circuits is paid. 2027 registration fees are not yet published; the first call for papers lists dates and venue only.
Who should attend 2027 Symposium on VLSI Technology and Circuits?
2027 Symposium on VLSI Technology and Circuits is aimed at Semiconductor process and device engineers, Chip architects and SoC designers, AI accelerator hardware teams, CTOs and R&D heads at semiconductor and systems companies, Memory and packaging technologists, Academic researchers in microelectronics.
What topics does 2027 Symposium on VLSI Technology and Circuits cover?
2027 Symposium on VLSI Technology and Circuits covers Devices and accelerators for ML/DL, Advanced CMOS and backside power delivery, Chiplets and 2.5D/3D heterogeneous integration, Memory technologies and architectures, Optical interconnects and wireline transceivers, Processors and SoCs, Beyond-CMOS and quantum computing devices, Hardware security.

Sources

This page was written from 4 sources, 2 on domains other than vlsisymposium.org.

  1. 1.vlsisymposium.org — VLSI2027 1stCFP.pdfvendor
  2. 2.vlsisymposium.org — greetingvendor
  3. 3.clocate.com — 27478
  4. 4.microwavejournal.com — 43802 the 2025 symposium on vlsi technology and circuits con
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