2027 OCP APAC Summit
by Open Compute Project Foundation
The Open Compute Project's Asia-Pacific summit on hyperscale and AI data center infrastructure, in Taipei
About This Event
The 2027 OCP APAC Summit is the Open Compute Project Foundation's regional conference for the Asia-Pacific data center community, held August 10-12, 2027 in Taipei, Taiwan. It brings together the people who design, build and run hyperscale data center facilities and infrastructure, with expert talks and an Expo Hall that connects buyers and sellers across the hardware supply chain. Taipei puts the summit next to the original design manufacturers and component makers that build much of the world's AI server hardware. The 2026 edition, held August 11-12 in Taipei, had keynote sponsors including AMD, Applied Materials, Arm, ASE, Broadcom, Google, Microsoft, NVIDIA and TSMC. The 2027 edition adds a third day. OCP says the call for presentations and registration both open at the beginning of April, and the event is in-person.
At a Glance
- Date
- August 10–12, 2027
- Location
- Taipei, Taiwan
- Format
- In-Person
- Event Type
- Summit
- Status
- Upcoming
- Pricing
- Paid
- Organizer
- Open Compute Project Foundation
- Added
- Nov 8, 2026
- Updated
- Nov 8, 2026
Topics & Focus Areas
Who Should Attend
- ✓Data center infrastructure architects
- ✓Hardware and systems engineers
- ✓Original design manufacturers (ODMs)
- ✓Hyperscale and cloud operators
- ✓Supply chain and procurement leaders
- ✓CTOs and VPs of infrastructure
Why Attend
For infrastructure and procurement leaders sourcing AI servers, racks, power or cooling, this summit puts the Taiwanese manufacturers, silicon vendors and hyperscale engineers in one place. You can test lead times and supply chain risk directly with the ODMs and component makers, see which OCP specifications they are building to, and compare vendors on the Expo floor before committing to a hardware roadmap or a multi-year capacity order.
Event Features
- ✓Expert talks on next-generation hyperscale data center facilities and infrastructure
- ✓Expo Hall connecting buyers and sellers across the ecosystem and supply chain
- ✓Call for presentations opening in early April 2027
- ✓Three-day in-person format, up from two days in 2026
What Makes This Unique
- ★Held in Taipei, beside the ODM and component supply base that manufactures much of the world's AI server hardware
- ★Run by the Open Compute Project Foundation, the body behind the open rack, power and cooling specifications used by hyperscalers
- ★2026 keynote sponsors included AMD, Applied Materials, Arm, ASE, Broadcom, Google, Microsoft, NVIDIA and TSMC
Industries Represented
Pricing Details
Registration prices for 2027 are not published. OCP says registration and the call for presentations open at the beginning of April 2027; the 2026 summit page did not list a price either. Sponsorship packages in Elite, Premier and Plus tiers are on sale now.
Organizer
Open Compute Project Foundation
opencompute.orgFrequently Asked
- When is 2027 OCP APAC Summit?
- 2027 OCP APAC Summit takes place August 10–12, 2027 in Taipei, Taiwan.
- Where is 2027 OCP APAC Summit held?
- 2027 OCP APAC Summit is held in Taipei, Taiwan. The event format is in-person.
- How much does 2027 OCP APAC Summit cost?
- 2027 OCP APAC Summit is paid. Registration prices for 2027 are not published. OCP says registration and the call for presentations open at the beginning of April 2027; the 2026 summit page did not list a price either. Sponsorship packages in Elite, Premier and Plus tiers are on sale now.
- Who should attend 2027 OCP APAC Summit?
- 2027 OCP APAC Summit is aimed at Data center infrastructure architects, Hardware and systems engineers, Original design manufacturers (ODMs), Hyperscale and cloud operators, Supply chain and procurement leaders, CTOs and VPs of infrastructure.
- What topics does 2027 OCP APAC Summit cover?
- 2027 OCP APAC Summit covers AI infrastructure, Hyperscale data center design, Open hardware specifications, Server and rack hardware supply chain, Data center cooling and power, Semiconductors and packaging.
Sources
This page was written from 4 sources, 1 on domains other than opencompute.org.
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