MAR202027

HPCA 2027 — 33rd IEEE International Symposium on High-Performance Computer Architecture

by IEEE Computer Society Technical Committee on Computer Architecture (TCCA)

conferenceIn-PersonUpcomingStarts in 8 months

Where the peer-reviewed work on AI silicon lands before it ships

March 20–24, 2027·Salt Lake City, Utah·Paid
Share:
THE DAILY BRIEF
MAR202027
HPCA 2027 — 33rd IEEE International Symposium on High-Performance Computer Architecture

by IEEE Computer Society Technical Committee on Computer Architecture (TCCA)

conferenceIn-Personupcoming

Where the peer-reviewed work on AI silicon lands before it ships

About This Event

HPCA 2027, the 33rd IEEE International Symposium on High-Performance Computer Architecture, runs 20-24 March 2027 in Salt Lake City, Utah. HPCA is one of the three top-tier computer architecture venues alongside ISCA and MICRO, and its call for papers names domain-specific architectures and accelerators, near/in-memory computing, neuromorphic computing, and cloud and datacenter systems as first-class areas — the research pipeline that feeds commercial AI silicon and the machines it runs on. Unlike its sibling conferences, HPCA runs a separate Industry Track with its own call for papers, explicitly for papers written by industry authors about real products and processes. The 2027 review timeline is public: papers were registered by 24 July 2026 and submitted by 31 July 2026, with a revision and rebuttal period from 28 September to 9 October 2026 and notification to authors on 6 November 2026.

At a Glance

Date
March 20–24, 2027
Location
Salt Lake City, Utah
Format
In-Person
Event Type
Conference
Status
Upcoming
Pricing
Paid
Organizer
IEEE Computer Society Technical Committee on Computer Architecture (TCCA)
Added
Aug 9, 2026
Updated
Aug 9, 2026

Topics & Focus Areas

AI AcceleratorsComputer ArchitectureDomain-Specific ArchitecturesNear/In-Memory ComputingNeuromorphic ComputingDatacenter and Cloud SystemsEnergy Efficiency and SustainabilityHardware Security

Who Should Attend

  • Chief Technology Officers
  • VPs of Infrastructure
  • AI infrastructure architects
  • Silicon and hardware engineers
  • ML systems engineers
  • Datacenter capacity planners
  • Academic and industrial researchers

Organizer

I

IEEE Computer Society Technical Committee on Computer Architecture (TCCA)

conf.researchr.org/home/hpca-2027

THE DAILY BRIEF

Enterprise AI insights for technology and business leaders, twice weekly.

beri.net

Subscribe at beri.net/subscribe for twice-weekly AI insights delivered to your inbox.

LinkedIn: linkedin.com/in/rberi  |  X: x.com/rajeshberi

© 2026 Rajesh Beri. All rights reserved.

About This Event

HPCA 2027, the 33rd IEEE International Symposium on High-Performance Computer Architecture, runs 20-24 March 2027 in Salt Lake City, Utah. HPCA is one of the three top-tier computer architecture venues alongside ISCA and MICRO, and its call for papers names domain-specific architectures and accelerators, near/in-memory computing, neuromorphic computing, and cloud and datacenter systems as first-class areas — the research pipeline that feeds commercial AI silicon and the machines it runs on. Unlike its sibling conferences, HPCA runs a separate Industry Track with its own call for papers, explicitly for papers written by industry authors about real products and processes. The 2027 review timeline is public: papers were registered by 24 July 2026 and submitted by 31 July 2026, with a revision and rebuttal period from 28 September to 9 October 2026 and notification to authors on 6 November 2026.

Key Dates & Deadlines

  • Revision / rebuttal period opens
  • Revision / rebuttal period closes
  • Notification to authors

At a Glance

Date
March 20–24, 2027
Location
Salt Lake City, Utah
Format
In-Person
Event Type
Conference
Status
Upcoming
Pricing
Paid
Organizer
IEEE Computer Society Technical Committee on Computer Architecture (TCCA)
Added
Aug 9, 2026
Updated
Aug 9, 2026

Topics & Focus Areas

AI AcceleratorsComputer ArchitectureDomain-Specific ArchitecturesNear/In-Memory ComputingNeuromorphic ComputingDatacenter and Cloud SystemsEnergy Efficiency and SustainabilityHardware Security

Who Should Attend

  • Chief Technology Officers
  • VPs of Infrastructure
  • AI infrastructure architects
  • Silicon and hardware engineers
  • ML systems engineers
  • Datacenter capacity planners
  • Academic and industrial researchers

Why Attend

If your 2027-2029 capital plan involves buying, renting or designing AI compute, HPCA is where the evidence behind those machines is argued in public two to three years before it reaches a product datasheet. A CTO or VP of infrastructure leaves with a grounded read on where accelerator, memory-bandwidth and in-memory-computing designs are actually heading, which vendor claims have peer-reviewed support, and which do not. The Industry Track puts named engineers from operating companies in the room, and the published review timeline means the accepted programme is visible well before you commit travel.

Event Features

  • Main conference track covering domain-specific architectures and accelerators
  • Separate Industry Track with its own call for papers, for papers by industry authors whose content relates to industrial products or processes
  • Near/in-memory computing and neuromorphic computing topic areas
  • Cloud, datacenter and cluster/distributed systems architecture topics
  • 3D, chiplet, interposer and wafer-scale packaging topics
  • Reliability, fault tolerance, energy efficiency and sustainability of computer systems

What Makes This Unique

  • One of the three top-tier computer architecture venues (with ISCA and MICRO), and the one that runs a dedicated Industry Track with its own call for papers for work on shipping products and processes
  • The call for papers names domain-specific architectures and accelerators as an explicit area of interest — this is the peer-reviewed pipeline behind commercial AI silicon, not a vendor roadmap session
  • The full review timeline is published in advance: rebuttal 28 September - 9 October 2026, notification 6 November 2026, so the accepted programme is known months before the March 2027 meeting
  • Held in March, ahead of the ISCA/MICRO summer-autumn cycle, so it is the year's first look at new architecture results

Industries Represented

SemiconductorsCloud InfrastructureEnterprise ITAcademic Research

Pricing Details

Registration rates for HPCA 2027 are not published yet — the conference site currently carries the call for papers and review timeline only, with no pass tiers listed.

Organizer

I

IEEE Computer Society Technical Committee on Computer Architecture (TCCA)

conf.researchr.org/home/hpca-2027

Frequently Asked

When is HPCA 2027?
HPCA 2027 takes place March 20–24, 2027 in Salt Lake City, Utah.
Where is HPCA 2027 held?
HPCA 2027 is held in Salt Lake City, Utah. The event format is in-person.
What is the HPCA 2027 submission deadline?
The next HPCA 2027 deadline is revision / rebuttal period opens on Sep 28, 2026. Remaining dates: Revision / rebuttal period closes — Oct 9, 2026; Notification to authors — Nov 6, 2026.
How much does HPCA 2027 cost?
HPCA 2027 is paid. Registration rates for HPCA 2027 are not published yet — the conference site currently carries the call for papers and review timeline only, with no pass tiers listed.
Who should attend HPCA 2027?
HPCA 2027 is aimed at Chief Technology Officers, VPs of Infrastructure, AI infrastructure architects, Silicon and hardware engineers, ML systems engineers, Datacenter capacity planners, Academic and industrial researchers.
What topics does HPCA 2027 cover?
HPCA 2027 covers AI Accelerators, Computer Architecture, Domain-Specific Architectures, Near/In-Memory Computing, Neuromorphic Computing, Datacenter and Cloud Systems, Energy Efficiency and Sustainability, Hardware Security.

Sources

This page was written from 3 sources, 1 on domains other than conf.researchr.org.

  1. 1.conf.researchr.orghpca 2027vendor
  2. 2.conf.researchr.orghpca 2027 main conferencevendor
  3. 3.sigarch.orghpca 2027
Newsletter

Stay Ahead of the Curve

Weekly enterprise AI insights for technology leaders. No spam, no vendor pitches—unsubscribe anytime.

Subscribe